Failure mechanism for alloy KhN6 7VM under the action of a copper-silver solder

Autor: Semenov, V. N., Alekseeva, L. E., Khatsinskaya, I. M., Lubnin, E. N.
Zdroj: Metal Science and Heat Treatment; August 1982, Vol. 24 Issue: 8 p566-571, 6p
Abstrakt: 1.A dispersion-hardened alloy based on Ni-Cr is susceptible to a reduction in strength under the action of solder in the temperature range 850–920°C.2.Alloy failure under the action of solder is caused by the simultaneous effect of tensile stresses in the alloy and the presence of surface-active fused solder.3.The main factor causing a reduction in the tendency of alloy Kh6 7VM towards crack formation (or crazing) during soldering is stabilization of its structure (formation of ?'-phase agglomeration before soldering).
Databáze: Supplemental Index