| Autor: |
Wu, Kepeng, Wade, Noboru, Cui, Jie, Miyahara, Kazuya |
| Zdroj: |
Journal of Electronic Materials; January 2003, Vol. 32 Issue: 1 p5-8, 4p |
| Abstrakt: |
Abstract: The effect of microstructure obtained by rapid or slow solidification and cooling of a Sn-3.5%Ag lead-free solder alloy on the creep strength has been investigated. The rapidly cooled alloy showed that the microstructure consisted of the primarily crystallized Sn phase and the quasi-eutectic phase, where fine Ag3Sn particles dispersed in the Sn matrix. In the slowly cooled alloy, large platelets of Ag3Sn were formed sparsely in the Sn matrix. A difference of about 2.5 orders of magnitude in the cooling rate translates to about 1.5 orders of magnitude in the creep-rupture time. Accordingly, fine particle dispersion of Ag3Sn is considered to be very beneficial for the restraining of creep deformation, that is, for the decreasing of creep rate of the Sn-3.5%Ag alloy, compared with the effect of large platelets of Ag3Sn sparsely formed in the Sn matrix. |
| Databáze: |
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