Selective dry etching of InGaP over GaAs in inductively coupled plasmas

Autor: Leerungnawarat, P., Cho, H., Hays, D., Lee, J., Devre, M., Reelfs, B., Johnson, D., Sasserath, J., Abernathy, C., Pearton, S.
Zdroj: Journal of Electronic Materials; May 2000, Vol. 29 Issue: 5 p586-590, 5p
Abstrakt: Abstract: By exploiting the relatively high volatility of In etch products in CH4/H2 discharges, we were able to obtain a maximum selectivity for InGaP over GaAs of ∼20 at low ion energies and fluxes. Three different inert gas additives to CH4/H2 were examined, with Ar producing higher selectivities than He or Xe. This process is attractive for selective removal of the InGaP emitter in the fabrication of heterojunction bipolar transistors.
Databáze: Supplemental Index