| Autor: |
Nalwa, H. S., Suzuki, M., Takahashi, A., Kageyama, A., Nomura, Y., Honda, Y. |
| Zdroj: |
Chemistry of Materials; September 21, 1998, Vol. 10 Issue: 9 p2462-2469, 8p |
| Abstrakt: |
Polyquinoline/bismaleimide blend thin films containing 5−60 wt % bismaleimide contents have been investigated as high-temperature resistant materials. Dynamic mechanical analysis and thermal gravimateric analysis were performed to evaluate the mechanical and thermal properties of blend thin films. From thermogravimetric analysis, 5% weight loss was observed between 450 and 535 °C for blend thin films containing 5−60 wt % bismaleimide loading. The glass transition temperatures were found to be between 275 and 360 °C for blend thin films containing 5−50 wt % bismaleimide contents. The prepolymer blend thin films showed thermosetting behavior on curing at elevated temperatures. These high performance miscible thermosetting polymers obtained by blending of bismaleimide exhibit interesting mechanical, thermal, and solvent-resistant properties without sacrificing the inherent physical properties of the polyquinoline backbone. |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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