Analysis of Thermal Field on Integrated LED Light Source Based on COMSOL Multi-physics Finite Element Simulation.

Autor: Li, Jingsong, Yang, Qingxin, Niu, Pingjuan, Jin, Liang, Meng, Bo, Li, Yang, Xiao, Zhaoxia, Zhang, Xian
Předmět:
Zdroj: Physics Procedia; Dec2011, Vol. 22, p150-156, 7p
Abstrakt: Abstract: This paper obtained the average integrated heat transfer coefficient for the thermal resistance of a classic of integrated LED light source and its cooling fin-root on the basis of thermal circuit method. Simulation analysis on its steady-state temperature field distribution using COMSOL Multi-physics finite element method was carried out. This method has high precision and intuitive simulation results. The iteration method of the Numerical Analysis is introduced into method for the first time. The results have significant promotion on the LED cast light structure optimization and the affection of reduced heat coupling on the light temperature distribution. The comparison between thermocouple experimental data and calculation results proved the correctness and validity of the proposed method. This experimental study plays a guiding role to thermal analysis and design of other integrated lights. [Copyright &y& Elsevier]
Databáze: Supplemental Index