| Autor: |
Yeonseop Yu, Jinseok Kim, DoKyung Lim, SeongJae Lee, MiYang Kim, SangWon Lee, JongSoo Yoo |
| Předmět: |
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| Zdroj: |
Journal of The Electrochemical Society; 2010, Vol. 157 Issue 12, pD620-D623, 4p |
| Abstrakt: |
Nanoscale voiding in electrolytic Ni/Au was studied by varying Au strike deposition conditions. Two kinds of voids were observed in electrolytic Ni/Au when electric current was not applied during strike plating. One was located along the interface between Ni and Au, which could deteriorate the adhesion between Ni and Au. The other was nanoscale bubbles coated with Ni inside Au film, which could result in porous Au layer. Our results suggest that Ni could grow on the surface of hydrogen bubbles and then the bubbles trapped in the Au film. Needlelike Au or Au whiskers were also observed on the Au surface and a line of nanoscale voids was found beneath Au whiskers when electric current was not applied during Au strike process. We propose a model that the nanoscale voiding and Au whisker formation could be related to a galvanic displacement reaction and hydrogen evolution at the early stage of Au electrodeposition. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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