A Cutting-Wire System for Removal of Indirect Bonding Trays.

Autor: Miklus, Vetea G., Alibert, Jean-Paul, White, Shane N.
Předmět:
Zdroj: Journal of Clinical Orthodontics; Dec2005, Vol. 39 Issue 12, p706-709, 4p
Abstrakt: The article discusses a method for cutting the silicone or polyvinyl siloxane trays which are used in indirect-bonding techniques in orthodontics. It highlights the laboratory and clinical procedures for the removal of indirect bonding trays. According to the article, the wire-cutting method is safe and effective in reducing bond failures in most indirect techniques.
Databáze: Supplemental Index