| Autor: |
Grasser, Tibor, Selberherr, Siegfried, Cea, S. M., Eremenko, A., Fleischmann, P., Giles, M. D., Halama, S., Heinz, F. O., Ivanov, A. N., Keys, P. H., Lilak, A. D. |
| Zdroj: |
Simulation of Semiconductor Processes & Devices 2007; 2007, p361-364, 4p |
| Abstrakt: |
This paper describes advances and remaining challenges in unstructured 3D meshing techniques for both process and device simulations and parallelization of the process simulator FLOOPS. The meshing is performed using a point cloud manager to create points and an unstructured tetrahedral mesher. Distributed parallel techniques are used to parallelize the sparse matrix assembly and solution for 3D process diffusion simulations. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
|
