| Autor: |
Valldorf, Jürgen, Gessner, Wolfgang, Grieco, Barbara, Ausilio, D., Banfi, F., Chiesa, E., Frezza, G., Lasalandra, E., Galletta, P., Garavaglia, M., Mancaniello, A., Merassi, A., Pasolini, F., Sironi, G., Speroni, F., Tronconi, M., Ungaretti, T., Vigna, Benedetto, Zerbini, S. |
| Zdroj: |
Advanced Microsystems for Automotive Applications 2004; 2004, p211-222, 12p |
| Abstrakt: |
A 30 µg/sqrt(Hz) resolution MEMS based low-g 3-axis accelerometers targeted for emerging automotive application is presented. The device is composed by 2-dice in a single package: the sensing element and the processing IC. The sensing element is realized with an epitaxial micro-machining process (ThELMA™) while the IC uses a 0.5 μm BICMOS process. The IC amplifier is able to detect capacitive changes as low as 10 aF (10·10−18 F) and the device is able to provide both an analog and a digital output. Moreover it has very good linearity and very low cross talk between the sensing axes thanks to a design that fits very well the ST micro-machining process ThELMA. Finally, the proposed interface accelerometer is factory-trimmed to ensure repeatable performance without production-line adjustments in the end product The device is intended for new inertial applications in the automotive field that are expected to be heavily dominated by micromachined silicon components More specifically multiaxis accelerometers are particularly useful for emerging application like new generation ESP and ABS system, assisted navigation, headlight leveling, car alarm and virtual horizon. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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