| Autor: |
Cheng Lin, Fangang Tseng, Ching-Chang Chieng |
| Předmět: |
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| Zdroj: |
Journal of Electronic Packaging; Jun2008, Vol. 130 Issue 2, p02:1-02:9, 9p, 6 Diagrams, 4 Charts, 6 Graphs |
| Abstrakt: |
Conventional pick-and-place technology platform in handling microscale component assembly processes has technical limitations in terms of capacity, efficiency, and accuracy. The fluidic self-assembly (FSA) approach employs a lubricant fluid carrying micropart flows over a target wafer patterned with binding sites, which results in part-substrate attachment. This technique transports microparts from one location to another with orientation control and parallel sorting. The present study demonstrates a FSA approach for fast, economic, and precise handling of microscale parts with square (few are in rectangular) shapes. The microparts fabricated from silicon-oxide wafers and ranging in size from 350 × 350 × 170 μm3 to 1000 μ 1000 μ 440 μm3 aligned and filled to designated sites in the substrate under water. The effects of micropart sizes and lubricants on the FSA processes are compared. This study provides a fundamental analysis for achieving and optimizing the self-alignment. The polymer or solder adhesion force of the square-patterned micropart immobilized at the larger binding sites were estimated to be 117 ± 15 μN and 510 ± 50 μN, respectively, which results in higher assembly yield of up to 100% for these samples. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Supplemental Index |
| Externí odkaz: |
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