Autor: |
Virta, Jari |
Předmět: |
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Zdroj: |
Building & Environment; Oct2005, Vol. 40 Issue 10, p1395-1399, 5p |
Abstrakt: |
Abstract: The aim of the study was to examine how the thickness and heat-treatment of cladding boards affects cupping during cyclic conditions. The study was conducted with heat-treated and non-heat-treated cladding boards in laboratory conditions. On the basis of the results, thickness and heat-treatment both have a significant influence on cupping of the board. The cupping of heat-treated board was considerably lower than that of non-heat-treated board. [Copyright &y& Elsevier] |
Databáze: |
Supplemental Index |
Externí odkaz: |
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