| Abstrakt: |
This article discusses a design for microelectronics reliability. Product reliability is important because it affects the resources of manufacturers and customers alike. Many of these factors may interact synergistically, may cancel each other, or they may not be effective under field conditions. Electronic package circuitry and the solder interconnects at the die and package level can fail in terms of a number of mechanisms, such as fatigue, creep, corrosion, metal migration, electromigration, and thermomigration. |
