MoS2 as an Effective Cu Diffusion Barrier with a Back-End Compatible Process.

Autor: Kuo, Chi-Yuan, Chang, Ya-Ting, Huang, Yu-Ting, Ni, I-Chih, Chen, Mei-Hsin, Wu, Chih-I
Zdroj: ACS Applied Materials & Interfaces; 10/11/2023, Vol. 15 Issue 40, p47845-47854, 10p
Databáze: Supplemental Index