MoS2 as an Effective Cu Diffusion Barrier with a Back-End Compatible Process.
Autor: | Kuo, Chi-Yuan, Chang, Ya-Ting, Huang, Yu-Ting, Ni, I-Chih, Chen, Mei-Hsin, Wu, Chih-I |
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Zdroj: | ACS Applied Materials & Interfaces; 10/11/2023, Vol. 15 Issue 40, p47845-47854, 10p |
Databáze: | Supplemental Index |
Externí odkaz: |