Wafer Drying in Wet Processing: The Challenge of the Future.

Autor:	Funkhänel, Jürgen, Schupke, Kristin
Předmět:	SEMICONDUCTOR wafers MICROELECTRONICS SEMICONDUCTOR industry ELECTRONIC industries INTEGRATED circuits industry
Zdroj:	Semiconductor International; Oct2004, Vol. 27 Issue 11, p55-58, 3p, 2 Color Photographs, 1 Diagram, 3 Graphs
Abstrakt:	Presents information on wafer drying in wet processing. Challenges in wafer drying; Requirements in wafer drying performance; Discussion of various drying technologies used throughout the semiconductor industry.
Databáze:	Supplemental Index
Externí odkaz:	Zobrazit plný text záznamu