| Abstrakt: |
Recently, small-sized home appliances have been included in the recycling legislations of Japan. However, since small-sized home appliances have many varieties and individual products are small, it won’t be economically feasible to disassemble each e-waste manually. Thus, combinations of pulverization and physical separation technologies are being discussed. This paper applies pulverization plus physical separation for the basic recycling process of used mobile phones. By applying XRF analysis to classified particles, the paper clarifies that valuable material such as copper, silver, etc are more concentrated in printed circuit board (PCB) and relatively larger particles. Based on the result, the paper shows that separation of PCB-origin particles after rough pulverization can be a good strategy for low-cost and high-quality material recycling. Plus, the paper proposes a basic concept of a totally new recycling process so-called “remote separation,” for the future studies. [ABSTRACT FROM AUTHOR] |
