Modeling and simulation of silicon wafer backside grinding process.
| Autor: | Li, Zhaoqiang, Jing, Xiangmeng, Jiang, Feng, Zhang, Wenqi |
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| Zdroj: | 2014 15th International Conference on Electronic Packaging Technology; 2014, p874-877, 4p |
| Databáze: | Complementary Index |
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