Numerical analysis on MUF process for flip chip packaging.
| Autor: | Cheng, Xiyun, Wang, Qian, Tan, Lin, Li, Guanhua, Chen, Yu, Cai, Jian |
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| Zdroj: | 2014 15th International Conference on Electronic Packaging Technology; 2014, p703-710, 8p |
| Databáze: | Complementary Index |
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