Multilayer chip embedded based on the organic substrate.
| Autor: | Guo, Xueping, Yu, Zhongyao, Cao, Liqiang, Song, Yang, Sun, Yu, Fang, Zhidan, Hao, Hu, Ding, Guowei |
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| Zdroj: | 2014 15th International Conference on Electronic Packaging Technology; 2014, p66-69, 4p |
| Databáze: | Complementary Index |
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