Towards ultrasonic through-silicon vias (UTSV).
| Autor: | Kuo, Justin, Hoople, Jason, Ardanuc, Serhan, Lal, Amit |
|---|---|
| Zdroj: | 2014 IEEE International Ultrasonics Symposium; 2014, p483-486, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
| Autor: | Kuo, Justin, Hoople, Jason, Ardanuc, Serhan, Lal, Amit |
|---|---|
| Zdroj: | 2014 IEEE International Ultrasonics Symposium; 2014, p483-486, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|