Chapter 1: IMPACT OF PHYSICAL TECHNOLOGY ON ARCHITECTURE: 1.7 ADVANCED PACKAGING.
| Autor: | Edmondson, John H. |
|---|---|
| Zdroj: | Design of High-Performance Microprocessor Circuits; 2000, p21-22, 2p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Edmondson, John H. |
|---|---|
| Zdroj: | Design of High-Performance Microprocessor Circuits; 2000, p21-22, 2p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|