Wafer-Level Packaging TSV/Stack Die for Integration of Analog and Power Solution.
| Autor: | Qu, Shichun, Liu, Yong |
|---|---|
| Zdroj: | Wafer-Level Chip-Scale Packaging; 2015, p119-146, 28p |
| Databáze: | Complementary Index |
| Externí odkaz: |
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| Autor: | Qu, Shichun, Liu, Yong |
|---|---|
| Zdroj: | Wafer-Level Chip-Scale Packaging; 2015, p119-146, 28p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|