| Autor: |
Field, David P., Sanchez Jr., John E., Besser, Paul R., Dingley, David J. |
| Předmět: |
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| Zdroj: |
Journal of Applied Physics; 9/1/1997, Vol. 82 Issue 5, p2383, 10p, 10 Black and White Photographs, 3 Graphs |
| Abstrakt: |
Focuses on the characterization of texture and grain-boundary structure of Al-Cu interconnect lines using orientation imaging microscopy, and upon the linewidth dependence of the measures. Postpatterning anneal on boundary structure as a function of linewidth; Conventionally fabricated specimens; Crystallographic texture. |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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