Study on the high via resistance by TEM failure analysis.
| Autor: | Liu, Binghai, Er, Eddie, Zhao, Si Ping, Chen, Changqing, Boon, Ang Ghim, Takahashi, Kunihiko, Subbu, Chivukula, Lam, Jeffrey |
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| Zdroj: | Proceedings of the 21th International Symposium on the Physical & Failure Analysis of Integrated Circuits (IPFA); 2014, p58-61, 4p |
| Databáze: | Complementary Index |
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