Warpage characterization of panel Fan-out (P-FO) package.
| Autor: | Liu, Hung-Wen, Liu, Yi-Wei, Ji, Jason, Liao, Jash, Chen, Agassi, Chen, Yan-Heng, Kao, Nicholas, Lai, Yi-Che |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1750-1754, 5p |
| Databáze: | Complementary Index |
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