Comparison of new die-attachment technologies for power electronic assemblies.

Autor: Moller, Eike, Bajwa, Adeel Ahmad, Rastjagaev, Eugen, Wilde, Jurgen
Zdroj: 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1707-1713, 7p
Databáze: Complementary Index