Comparison of new die-attachment technologies for power electronic assemblies.
Autor: | Moller, Eike, Bajwa, Adeel Ahmad, Rastjagaev, Eugen, Wilde, Jurgen |
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Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1707-1713, 7p |
Databáze: | Complementary Index |
Externí odkaz: |