Novel TSV process technologies for 2.5D/3D packaging.
Autor: | Morikawa, Y., Murayama, T., Sakuishi, T., Suzuki, A., Nakamuta, Y., Suu, K. |
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Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1697-1699, 3p |
Databáze: | Complementary Index |
Externí odkaz: |