Novel TSV process technologies for 2.5D/3D packaging.

Autor: Morikawa, Y., Murayama, T., Sakuishi, T., Suzuki, A., Nakamuta, Y., Suu, K.
Zdroj: 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1697-1699, 3p
Databáze: Complementary Index