Residual stress investigations at TSVs in 3D micro structures by HR-XRD, Raman spectroscopy and fibDAC.
| Autor: | Zschenderlein, U., Vogel, D., Auerswald, E., Holck, O., Rajendran, H., Ramm, P., Pufall, R., Wunderle, B. |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p1134-1142, 9p |
| Databáze: | Complementary Index |
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