Versatile thin wafer stacking technology for monolithic integration of temporary bonded thin wafers.
| Autor: | Uhrmann, Thomas, Burggraf, Jurgen, Bravin, Julian, Dragoi, Viorel, Wimplinger, Markus, Matthias, Thorsten, Lindner, Paul |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p888-893, 6p |
| Databáze: | Complementary Index |
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