TSV module optimization for high performance silicon interposer.
| Autor: | Cao, Andrew, Dinan, Thomas, Sun, Zhuowen, Gao, Guilian, Uzoh, Cyprian, Lee, Bong-Sub, Wang, Liang, Shen, Hong, Arkalgud, Sitaram |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p862-867, 6p |
| Databáze: | Complementary Index |
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