Defect detection in Through Silicon Vias by GHz Scanning Acoustic Microscopy: Key ultrasonic characteristics.
| Autor: | Phommahaxay, Alain, De Wolf, Ingrid, Djuric, Tatjana, Hoffrogge, Peter, Brand, Sebastian, Czurratis, Peter, Philipsen, Harold, Beyer, Gerald, Struyf, Herbert, Beyne, Eric |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p850-855, 6p |
| Databáze: | Complementary Index |
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