A stress-based effective film technique for wafer warpage prediction of arbitrarily patterned films.
| Autor: | Ostrowicki, Gregory T., Gurrum, Siva P. |
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| Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p821-828, 8p |
| Databáze: | Complementary Index |
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