Low-cost TSH (through-silicon hole) interposers for 3D IC integration.

Autor: Lau, John H., Lee, Ching-Kuan, Zhan, Chau-Jie, Wu, Sheng-Tsai, Chao, Yu-Lin, Dai, Ming-Ji, Tain, Ra-Min, Chien, Heng-Chieh, Chien, Chun-Hsien, Cheng, Ren-Shin, Huang, Yu-Wei, Lee, Yuan-Chang, Hsiao, Zhi-Cheng, Tsai, Wen-Li, Chang, Pai-Cheng, Fu, Huan-Chun, Cheng, Yu-Mei, Liao, Li-Ling, Lo, Wei-Chung, Kao, Ming-Jer
Zdroj: 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p290-296, 7p
Databáze: Complementary Index