High power density LED modules with silver sintering die attach on aluminum nitride substrates.
Autor: | Schneider, Marc, Leyrer, Benjamin, Herbold, Christian, Maikowske, Stefan |
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Zdroj: | 2014 IEEE 64th Electronic Components & Technology Conference (ECTC); 2014, p203-208, 6p |
Databáze: | Complementary Index |
Externí odkaz: |