Electrical parametric and reliability of 5×50um TSVs for 3D IC.
| Autor: | Bhushan, Bharat, Toh, Chin Hock, Chan, Anthony, Ow, Isaac, Wong, Loke Yuen, Barman, Arkajit Roy, Sudheeran, Shalina, Rao, Chandra, Abdul, Wahab Mohammed, Chew, Jason, Vijayen, Jay, Mahajan, Uday, Ericson, David, Kumar, Niranjan, Ramaswami, Sesh, Sundarrajan, Arvind |
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| Zdroj: | IEEE International Interconnect Technology Conference; 2014, p363-366, 4p |
| Databáze: | Complementary Index |
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