Using state-space models for accurate computations of transient thermal behavior of electronic packages.
| Autor: | Shankaran, Gokul V., Dogruoz, M. Baris, Magargle, Ryan |
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| Zdroj: | Fourteenth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2014, p990-997, 8p |
| Databáze: | Complementary Index |
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