Failure analysis of thermal degradation of TIM during power cycling.
| Autor: | Zhang, H., Li, S., Liu, H., Bunt, J., Pompeo, F., Sikka, K., Rivera, K. C., Longworth, H., Lian, C. |
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| Zdroj: | Fourteenth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2014, p404-408, 5p |
| Databáze: | Complementary Index |
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