Micro-mechanical characterization of lead-free solder joints in power electronics.
| Autor: | Jules, Samuel, Ryckelynck, David, Duhamel, Cecilie, Bienvenu, Yves, Bisson, Jean-Francois, Leon, Renan |
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| Zdroj: | Fourteenth Intersociety Conference on Thermal & Thermomechanical Phenomena in Electronic Systems (ITherm); 2014, p107-111, 5p |
| Databáze: | Complementary Index |
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