Package on package DDR Power Integrity Design.
| Autor: | Heng Chuan Shu, Li Chuang Quek |
|---|---|
| Zdroj: | 2014 International Conference on Electronics Packaging (ICEP); 2014, p559-562, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|
| Autor: | Heng Chuan Shu, Li Chuang Quek |
|---|---|
| Zdroj: | 2014 International Conference on Electronics Packaging (ICEP); 2014, p559-562, 4p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|