A novel 3D IC assembly process for ultra-thin chip stacking.
| Autor: | Yu-Min Lin, Chau-Jie Zhan, Zhi-Cheng Hsiao, Huan-Chun Fu, Ren-Shin Cheng, Yu-Wei Huang, Shin-Yi Huang, Su-Mei Chen, Chia-Wen Fan, Chun-Hsien Chien, Cheng-Ta Ko, Yu-Huan Guo, Chang-Chun Lee, Tsutsumi, Yoshihiro, Junsoo Woo, Suzuki, Yoshikazu, Sato, Yusuke, Chien-Ting Liu, Chih-Heng Chao |
|---|---|
| Zdroj: | 2014 International Conference on Electronics Packaging (ICEP); 2014, p470-474, 5p |
| Databáze: | Complementary Index |
| Externí odkaz: |
|