Process integration of 3D stacking for backside illuminated image sensor.
| Autor: | Hsiao, Zhi-Cheng, Ko, Cheng-Ta, Chang, Hsiang-Hung, Fu, Huan-Chun, Chao-Kai Hsu, Shu-Man Li, Tsai, Wen-Li, Wen-Wei Shen, Jen-Chun Wang, Yu-Min Lin, Wei-Chung Lo |
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| Zdroj: | 2014 International Conference on Electronics Packaging (ICEP); 2014, p82-85, 4p |
| Databáze: | Complementary Index |
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