Copper-to-dielectric heterogeneous bonding for 3D integration.
| Autor: | Wei Lin, Juntao Li, Washington, Joseph, Rath, David, Skordas, Spyridon, Kirihata, Toshiaki, Winstel, Kevin, Peethala, Brown, Demarest, James, Da Song, Edelstein, Daniel, Iyer, Subramanian |
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| Zdroj: | 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D); 2014, p6-6, 1p |
| Databáze: | Complementary Index |
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