| Autor: |
Muray, L. P., Rathbun, L. C., Wolf, E. D. |
| Předmět: |
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| Zdroj: |
Applied Physics Letters; 10/10/1988, Vol. 53 Issue 15, p1414, 3p |
| Abstrakt: |
Electromigration failure of a series-parallel configuration of aluminum interconnects overlayed on tungsten contacts was measured using a novel multiple lognormal analysis. The analysis examined early failure mechanisms and allowed rapid determination of electromigration parameters on a statistically large number of junctions. The primary failure mode of these stuctures was complete migration of Al off of the W pads. This work suggested that Al/W metallizations, with a large number of series contacts, are prone to short mean time to failures. [ABSTRACT FROM AUTHOR] |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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