Demonstration of high-performance silicon microchannel heat exchangers for laser diode array cooling.

Autor: Mundinger, D., Beach, R., Benett, W., Solarz, R., Krupke, W., Staver, R., Tuckerman, D.
Předmět:
Zdroj: Applied Physics Letters; 9/19/1988, Vol. 53 Issue 12, p1030, 3p
Abstrakt: A heat exchanger package has been demonstrated for semiconductor laser arrays using silicon microstructures with water as the coolant. A thermal impedance of 0.04 °C cm2/W has been achieved for a single linear bar. This design makes use of efficient, edge-emitting laser diode arrays in a rack and stack architecture combined with a high-performance silicon microchannel structure to allow cw operation. The architecture can be scaled to large areas and we project a thermal impedance of 0.09 °C cm2/W for close-packed two-dimensional arrays on this device. [ABSTRACT FROM AUTHOR]
Databáze: Complementary Index