Combining fault tolerance and serialization effort to improve yield in 3D Networks-on-Chip.
| Autor: | Kologeski, Anelise, Concatto, Caroline, Matos, Debora, Grehs, Daniel, Motta, Tiago, Almeida, Felipe, Kastensmidt, Fernanda Lima, Susin, Altamiro, Reis, Ricardo |
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| Zdroj: | 2013 IEEE 20th International Conference on Electronics, Circuits & Systems (ICECS); 2013, p125-128, 4p |
| Databáze: | Complementary Index |
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