Design for thermo-mechanical reliability of a 3D microelectronic component using 3D FEM.
| Autor: | Belhenini, Soufyane, Tougui, Abdellah, Dosseul, Franck |
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| Zdroj: | 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-6, 6p |
| Databáze: | Complementary Index |
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