Characterizing and modelling the behaviour of an isotropic conductive adhesive in view of electronic assembly fatigue life studies under thermal cycling.
| Autor: | Pin, S., Sartor, M., Michel, L., Parain, J., Dareys, S. |
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| Zdroj: | 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-7, 7p |
| Databáze: | Complementary Index |
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