Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards.
| Autor: | Macurova, Katerina, Angerer, Paul, Schongrundner, Ronald, Krivec, Thomas, Morianz, Mike, Antretter, Thomas, Bermejo, Raul, Pletz, Martin, Brizoux, Michel, Maia, Wilson |
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| Zdroj: | 2014 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation & Experiments in Microelectronics & Microsystems (EuroSimE); 2014, p1-7, 7p |
| Databáze: | Complementary Index |
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