| Autor: |
Schwartz, Daniel B., Chun, Christopher K.Y |
| Předmět: |
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| Zdroj: |
IEEE Transactions on Components, Packaging & Manufacturing Technology, Part B; Aug96, Vol. 19 Issue 3, p532, 8p, 2 Black and White Photographs, 4 Diagrams, 4 Graphs |
| Abstrakt: |
Details the design of the Optobus link, a ten-channel parallel bidirectional data link based on multimode fiber ribbons. Production of an optical interconnect capable of competing with copper on price and performance; Design focus on minimizing the complexity of the optical subassembly; Use of AIGaAs/GaAs vertical cavity surface emitting lasers (VCSELs). |
| Databáze: |
Complementary Index |
| Externí odkaz: |
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