Resin cure monitoring by means of dielectric analysis (DEA).

Autor: Spörrer, Andreas, Knappe, Stephan, Schmölzer, Stefan
Předmět:
Zdroj: JEC Composites Magazine; Apr2014, Issue 88, p76-1, 4p
Abstrakt: The article presents the differential scanning calorimetry (DSC) and dielectric analysis (DEA) as well-established methods to investigate cross-linking behaviour. Topics covered include the use of DEA technology in a wide field of applications ranging from cure monitoring of resin formulations to moulding process control in the composite manufacturing industry, the main features of DEA including its application in the laboratory and the application of DEA to RTM, a resin infusion process.
Databáze: Complementary Index