Temperature-dependant thermal stress analysis of through-silicon-vias during manufacturing process.
| Autor: | Su, Meiying, Zhang, Xia, Wan, Lixi, Yu, Daquan, Jing, Xiangmeng, Fang, Zhidan, Hou, Fengze |
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| Zdroj: | 2013 14th International Conference on Electronic Packaging Technology; 2013, p551-554, 4p |
| Databáze: | Complementary Index |
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